Cooling has always been a challenge when it comes to power design. onsemi offers the new top cooling MOSFETs to address this issue by changing the heatsink to the top of the device. This allows heat to be dissipated directly into a heatsink while heat propagation is mainly through printed circuit board with typical surface mount devices. The top cool package also reduces the size of PCB and improves thermal performance. This application note discusses all of the benefits of implementing top cool MOSFETs in your system.