White Paper Overview 

The significant increase in the number of electronic control units (ECUs) by automotive OEMs and the wide ECU power range, from a few to over a hundred watts, have increased the need for effective thermal management to lower thermal stress on components and to increase system reliability.

This paper describes in detail an experiment that measures MOSFET temperatures and creates device thermal profiles for various thermal management approaches. You will learn about the thermal impact of different parameters, such as thermal resistance and gap pad thickness, in designs with and without heat sinks as well as with bottom- and top-side heat sink mounting.