Smart devices today demand secure wireless connectivity, longer battery life, and a simpler path to deployment. This is true for applications from connected defibrillators to badge printers and commercial door locks. The challenge? Two-chip designs are bulky, and single-chip SoCs often fall short on RF performance.

In this webinar, Ezurio and Infineon will demonstrate how you can replace two-chip systems with a secure, low-power module built for next-gen devices. The Veda IF912/913 modules feature Infineon’s AIROC™ CYW55912 and CYW55913 chipsets. They have built-in Wi-Fi 6/6E + Bluetooth® LE and flexible SoC/NCP modes. This single platform can be used across multiple industries.

What you will learn:

• Real-world examples where bulky two-chip designs were replaced by a streamlined, scalable single-chip solution.
• How Infineon’s AIROC™ CYW5591x family integrates compute and connectivity to solve key design challenges around power, size, and RF performance.
• When to choose NCP vs. SoC modes and how this flexibility supports a range of device classes and architectures.
• How Ezurio’s globally certified Veda IF912/913 modules accelerate time to market with expert technical support and regional approvals
• Why IF912/913 is part of Ezurio’s premium module portfolio—and how to access early samples for evaluation.