The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

Topics Covered
  • Optimizing Thermal Gap Filler Applications with Automation
  • Challenges of Thermal Gap Filler Pick-and-Place
  • Embracing Automated Pick-and-Place

White Paper Overview

Automation in electronics manufacturing is nothing new, but today many thermal gap filler pads are still placed by hand. With an increasing demand for automation the need to incorporate gap filler pad installation into automated processes is growing. In this white paper from Fujipoly, we will cover what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.

Thank You For Your Interest

    By checking this box, I agree my personal information (including but not limited to my name and email) will be disclosed to Fujipoly and used according to Fujipoly's Privacy Policy, and I agree that it may be shared with Fujipoly's affiliates, which are based all over the world. I understand that my personal information may be transferred for processing outside my country of residence. I also understand Fujipoly may share some personal information with media partners, including but not limited to vendors and distributors. Fujipoly will use such information for Fujipoly's marketing purposes to contact me regarding Fujipoly's products and services.

    By clicking ‘Submit’ you agree to our Terms of Use. We take your privacy seriously. For more information please read our Privacy Policy. By registering with All About Circuits you will automatically receive our weekly Product Update and Technology Insider eNewsletters.