Rugged by Design: PCB Design for Harsh Environments

Topics Covered
  • Moisture, Humidity, Corrosion
  • Vibration & Shock
  • Thermal Stress & Management
  • Electromagnetic Interference (EMI)

Guide Overview

PCBs often face extreme conditions such as heat, vibration, moisture, and electromagnetic interference. Summit Interconnect’s “Designing PCBs for Harsh Environments Guide” provides practical strategies to help engineers protect their designs and ensure long-term reliability.

Inside the guide, you’ll find:
  • Moisture, Humidity & Corrosion Protection: conformal coating, potting, and nanocoatings
  • Vibration & Shock Mitigation: underfill, ruggedized components, and board stiffening
  • Thermal Stress Management: high-temp materials, thermal vias, copper planes, and metal cores
  • EMI Protection: shielding, grounding, and board-level layout best practices
Discover techniques to strengthen your printed circuit boards against demanding environments. Download the Designing PCBs for Harsh Environments Guide now and ensure your next design is built to last.

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