Open Standard Modules Provide the Pathway to Simpler High-Volume System Design

TOPICS COVERED

Open Standard Module Architecture and Specifications
OSM Versus Chip-Down and Traditional COM Designs
Automated Assembly, Testing and High-Volume Manufacturing
Carrier Board, Signal Integrity and Power Delivery Design
Edge AI Processing, Security and Software Enablement
Thermal Management, Lifecycle Planning and Platform Scalability

Asset Summary:

Edge AI deployment depends on more than proving the model or selecting the processor. As designs move toward production, engineering teams need hardware platforms that can support scale, lifecycle planning, software flexibility and long-term product evolution.

Avnet’s new edge AI resources bring together solution papers, market insights and supplier partner content to help design engineers connect system-level constraints to practical architecture decisions.

One featured resource is Tria’s white paper, Open Standard Modules Provide the Pathway to Simpler High-Volume System Design, developed with NXP. The paper examines how Open Standard Modules can simplify embedded system design for volume production.

In the white paper, engineers will find:

How computer-on-module formats are evolving for embedded design
Where OSM fits between chip-down design and traditional COM approaches
Why solder-down modules can support automated assembly and test
Design considerations for carrier boards, signal integrity and power delivery networks
Manufacturing and thermal management considerations for OSM-based systems
How Tria and NXP support scalable embedded platforms, software enablement and lifecycle planning

For teams moving edge AI systems from prototype to deployment, this paper provides useful context for modular design strategies that can reduce redesign risk and support future platform evolution.

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