Advantech and NXP explain how the OSM standard delivers ultra‑small, solder‑down modules with high pin density and long‑term scalability.
In a world rapidly transitioning toward localized intelligence, the separation of core system functions from peripheral components has become the gold standard for industrial agility. This guide details how standardized modular architectures like SMARC, Qseven, and the groundbreaking Open Standard Module (OSM) empower developers to scale computing power effortlessly by simply swapping modules rather than redesigning entire systems. By integrating NXP’s powerful i.MX 8 and i.MX 9 series processors—complete with dedicated neural processing for artificial intelligence—these solutions offer built-in “Security by Design” through hardware-isolated enclaves and secure boot mechanisms. Whether you are building compact medical devices, rugged robotics, or energy-efficient smart city infrastructure, this collaborative ecosystem slashes development time and risks, ensuring your products remain competitive and secure throughout their long-term lifecycle.
Key Takeaways:
- Tiny solder‑down modules
- High pin‑count scalability
- Ideal for IoT & compact systems