High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices

Topics Covered
  • IoT Market Growth and Device Miniaturization
  • Role of NOR Flash in Next-Gen Devices
  • Multi-Market Applications
  • Performance Innovations in the W25QxxRV Family
  • Reliability for Harsh and Emerging Environments

White Paper Overview

Winbond’s W25QxxRV NOR Flash memory is currently available in densities ranging from 1Mb to 32Mb, with higher densities set to be launched soon. The RV family offers low power consumption, a compact form factor, and supports industrial temperatures up to 105°C, making it suitable for various markets and applications.

To address these challenges, Winbond continues to lead with innovation through its latest NOR Flash memory family, the W25QxxRV. This series represents a substantial leap in performance and efficiency compared to earlier NOR Flash generations. Utilizing newly updated 58nm technology and optimized flash array architecture, the W25QxxRV offers several key advantages to customers. Download the white paper to learn more.

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