Fuji’s X-Series RC-IGBT Technology Enhancements to the Dual.XT Module

Topics Covered

Power Semiconductors: What’s Needed?
The Solution: Fuji Dual.XT Module with RC-IGBT Technology
Mitigation of Heat Generation

White Paper Overview

Fuji Electric’s new X-Series RC-IGBT technology enables a higher power rating in the Dual.XT IGBT module from ratings of 800A-1200V to 1000A-1200V & 600A-1700V to 800A-1700V in the existing module package. The technology makes it possible to replace the high-cost, large-form-
factor PrimePACK™ modules in power electronic systems.

Download this white paper to discover how Fuji’s X-Series RC-IGBT technology enhances the Dual.XT Module, offeris igher power ratings, improved efficiency, and a more compact design for advanced power semiconductor applications.

Thank You For Your Interest

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