Smarter, Faster, Connected: Building the Future of Smart Infrastructure with NXP and Ezurio

TOPICS COVERED

The evolving demands of smart buildings: from HVAC to AI-driven automation
Why integration of wireless, control, and security is critical at the edge
How pre-certified platforms reduce risk, cost, and time-to-market
The role of NXP’s i.MX 93 and Ezurio’s Sona™ NX611 in enabling scalable, secure solutions

Case Study Overview

As buildings become more intelligent and connected, the edge devices that power them must evolve. Today’s smart infrastructure demands more than just connectivity—it requires real-time control, AI capabilities, and long-term reliability in compact, low-power designs.

This whitepaper, developed by NXP and Ezurio, explores how a unified platform approach is transforming the development of smart building systems. By combining NXP’s i.MX 93 applications processor with Ezurio’s Sona™ NX611 Wi-Fi 6 and Bluetooth 5.4 module, the Nitrogen93 SMARC System-on-Module delivers a production-ready solution that simplifies RF integration, ensures thermal efficiency, and supports secure lifecycle management.

You’ll discover how this integrated platform helps OEMs meet the growing complexity of smart building requirements—without compromising on performance, security, or compliance.

Why Read This Whitepaper?

Design for the future: Learn how smart buildings are evolving and what edge devices need to support.
Simplify complexity: See how integrated platforms reduce RF challenges, certification hurdles, and thermal constraints.
Accelerate development: Discover how pre-certified modules and long-term software support speed up time-to-market.
Secure the edge: Understand how built-in security features like EdgeLock® Secure Enclave protect devices over their full lifecycle.

Whether you’re developing smart thermostats, access control panels, or occupancy hubs, this whitepaper will help you build smarter, faster, and more connected solutions.

Download this Case Study to explore how NXP and Ezurio are enabling the next generation of intelligent building infrastructure.

Thank You For Your Interest

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