Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

TOPICS COVERED


  • What the Cyber Resilience Act (CRA) means for OEMs and connected products
  • Key compliance deadlines and risks of non-compliance
  • CRA requirements for secure product design, lifecycle management, and vulnerability handling

White Paper Overview

Cybersecurity is no longer optional—it’s a legal requirement. With the introduction of the Cyber Resilience Act (CRA), the European Union has set a new standard for digital product compliance, mandating robust security measures across the entire product lifecycle. For OEMs and developers, this means rethinking how connected devices are designed, maintained, and brought to market.

This white paper, developed by NXP Semiconductors and Digi International, provides a practical guide to navigating CRA compliance. It outlines the key requirements, risks of non-compliance, and how integrated platforms—like Digi’s ConnectCore® SOMs powered by NXP’s secure processors—can simplify the path to certification.

You’ll gain insight into how scalable, secure-by-design solutions can help you meet CRA obligations while accelerating development and reducing risk.

Why read this white paper?

  • Understand the regulation: Learn what the CRA requires and how it impacts your product roadmap.
  • Design with confidence: Discover how NXP and Digi’s platforms support secure development from day one.
  • Simplify compliance: Explore tools for vulnerability management, SBOM generation, and secure updates.
  • Accelerate time-to-market: See how pre-integrated solutions reduce complexity and certification hurdles.

Whether you’re launching a new connected product or updating an existing one, this white paper will help you build with security, scalability, and compliance in mind.

Download the white paper to explore how NXP’s EdgeLock® and Digi’s ConnectCore® are enabling secure-by-design solutions for CRA compliance.

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